South Wales, July 3 -- United Kingdom Intellectual Property Office (UKIPO) has registered trademark "DRAGONFLY" on June 12. The details about the trademark application no. UK00004401387 published in the journal no. 2026/027 (July 3).
With D Young & Co LLP as representative, Qualcomm Incorporated filed the trademark application for the below mentioned good(s)/service(s).
Class 9 : Computer hardware; computer software; computer network server; network access server hardware; rack servers; mounting racks for computer hardware; semiconductors; semiconductor chipsets; semiconductor chips; semiconductor memories; electronic semiconductors; structured semiconductor wafers; semiconductor related integrated circuits; integrated circuits; integrated circuit cards; circuit boards; computer accelerator boards; multimedia accelerator boards; central processing units (CPU); central processing units (CPU) for servers; modems; microprocessors; microprocessors for server functionality; chipsets; chipsets for server functionality; recorded computer software for server functionality; downloadable computer software for server functionality; recorded optimization software for optimizing server performance; downloadable optimization software for optimizing server performance; recorded computer software platforms for optimizing server performance; downloadable computer software platforms for optimizing server performance; computer hardware, integrated circuits, semiconductor chipsets, central processing units (CPU), and modems for use in datacenters; computer hardware, integrated circuits, semiconductor chipsets, central processing units (CPU), and modems for optimizing server performance.
Class 42 : Design and development of computer hardware; design and development of computer software; customized design of computer hardware; customizing computer software; developing customized software for others; server hosting; scientific and technological services, namely, research and design in the field of semiconductors, semiconductor chips, semiconductor memories, electronic semiconductors, structured semiconductor wafers, and semiconductor related integrated circuits; design and development of semiconductors and integrated circuits; software as a service (SAAS) services; software as a service (SAAS) services featuring software for server functionality; software as a service (SAAS) services featuring software for optimizing server performance; platform as a service (PAAS) services; platform as a service (PAAS) services featuring computer software platforms for server functionality; platform as a service (PAAS) services featuring computer software platforms for optimizing server performance.
The original document can be viewed at: http://www.ipo.gov.uk/cgi-bin/redirect.cgi?type=tmj&link=6¶m1=UK00004401387
Disclaimer: Curated by HT Syndication.
